Journal Articles

2024

Microstructure and Bonding Properties of Transient Liquid-Phase Bonding using Cu–SnAgCu Molded Sheets by High Pressure Powder Compression
Ichizo Sakamoto*, Doojin Jeong, Hiroaki Tatsumi, Hiroshi Nishikawa
Journal of Electronic Materials, XX, XXXX (2024)
doi: 10.1007/s11664-024-11524-9

Low-temperature soldering using Sn/Bi electrodeposited bilayer
Wei-Li Wang, Sheng-Jye Cherng, Yu-Ting Huang, Runhua Gao, Hiroaki Tatsumi, Hiroshi Nishikawa*, Chih-Ming Chen*
Materials Science in Semiconductor Processing, 186, 109056 (2025)
doi: 10.1016/j.mssp.2024.109056

Study of the Characteristics and Growth of Tin Whiskers in Orbit
Shinichiro Ichimaru*, Tsuyoshi Nakagawa, Norio Nemoto, Katsuaki Suganuma, Hiroaki Tatsumi, Hiroshi Nishikawa
Microelectronics Reliability, 162, 115523 (2024)
doi: 10.1016/j.microrel.2024.115523

Thermal Decomposition Temperature Dependent Bonding Performance of Ag Nanostructures Derived from Metal-Organic Decomposition
Chuncheng Wang, Hiroaki Tatsumi, Hiroshi Nishikawa*
Journal of Materials Science, 59, 19038 (2024)
doi: 10.1007/s10853-024-10250-1

Substrate-Dependent Sintering Mechanism of Ag Nanostructures Derived from Ag-Based Complex
Chuncheng Wang, Hiroaki Tatsumi, Hiren Kotadia, Hiroshi Nishikawa*
ACS Applied Electronic Materials, 6, 7360 (2024)
doi: 10.1021/acsaelm.4c01253

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint
Peng Zhang, Songbai Xue*, Lu Liu, Jianhao Wang, Hiroaki Tatsumi, Hiroshi Nishikawa
Polymers, 16, 2597 (2024)
doi: 10.3390/polym16182597

Cu–Ni合金めっき膜を用いた金属/CFRTP接合部の疲労特性評価
小林 竜也*, 巽 裕章, 山崎 康平, 岡下 諒哉, 荘司 郁夫
銅と銅合金, 63, 176 (2024)
doi: 10.34562/jic.63.1_176

[解説記事] マイクロ接合向け固相接合挙動に関する分子動力学シミュレーション
巽 裕章
溶接学会誌, 93, 149 (2024)
doi: 10.2207/jjws.93.149

A comparative numerical study of thermo-mechanical behavior among various IMC joints under thermal cycling condition
Xunda Liu*, Hiroaki Tatsumi, Hiroshi Nishikawa*
Journal of Smart Processing, 13, 83 (2024)
doi: 10.7791/jspmee.13.83

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices
Chuncheng Wang, Hiroaki Tatsumi, Liang Xu*, Tao Zhao, Pengli Zhu, Rong Sun, Hiroshi Nishikawa*
ACS Applied Electronic Materials, 6, 1718 (2024)
doi: 10.1021/acsaelm.3c01629

Quasi-direct Cu–Si₃N₄ bonding using multi-layered active metal deposition for power-module substrate
Hiroaki Tatsumi*, Seongjae Moon, Makoto Takahashi, Takahiro Kozawa, Eiki Tsushima, Hiroshi Nishikawa
Materials & Design, 238, 112637 (2024)
doi: 10.1016/j.matdes.2024.112637

Interfacial reactions between In and Ag during solid liquid interdiffusion process
Xunda Liu*, Fupeng Huo, Jianhao Wang, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa*
Surfaces and Interfaces, 45, 103844 (2024)
doi: 10.1016/j.surfin.2024.103844

Analysis of microstructures and fractures in Ag–In transient liquid phase bonded joints
Xunda Liu*, Hiroaki Tatsumi, Jianhao Wang, Zhi Jin, Zhong Chen, Hiroshi Nishikawa*
Materials Science and Engineering: A, 892, 146045 (2024)
doi: 10.1016/j.msea.2023.146045

2023

Sn-Bi-Zn-In合金のBi含有量が微細組織と機械的特性に及ぼす影響
中脇 啓貴, 巽 裕章, 新田 隼也, Chih-han Yang, Shih-kang Lin, 西川 宏
溶接学会論文集, 41, 348 (2023)
doi: 10.2207/qjjws.41.348

Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations
Hiroaki Tatsumi*, C.R. Kao, Hiroshi Nishikawa
Scientific Reports, 13, 23030 (2023)
doi: 10.1038/s41598-023-50427-3

Thermomechanical Properties of Zeta (Ag₃In) Phase
Xunda Liu*, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa*
Materials, 16, 7115 (2023)
doi: 10.3390/ma16227115

Strength-enhanced Sn–In low-temperature alloy with surface-modified ZrO₂ nanoparticle addition
Shunya Nitta*, Hiroaki Tatsumi, Hiroshi Nishikawa*
Journal of Materials Science: Materials in Electronics, 34, 2066 (2023)
doi: 10.1007/s10854-023-11344-3

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints
Peng Zhang, Songbai Xue*, Lu Liu, Jianhao Wang, Hiroaki Tatsumi, Hiroshi Nishikawa
Polymers, 15, 4168 (2023)
doi: 10.3390/polym15204168

Fabrication and thermo-mechanical properties of Ag₉In₄ intermetallic compound
Xunda Liu*, Hiroaki Tatsumi, Zhi Jin, Zhong Chen, Hiroshi Nishikawa*
Intermetallics, 162, 108028 (2023)
doi: 10.1016/j.intermet.2023.108028

Comparative Study of Sn-based Solder Wettability on Aluminum Substrate
Jiahui Li*, Hiroaki Tatsumi, Hiroshi Nishikawa*
Quarterly Journal of the Japan Welding Society, 41, 26s (2023)
doi: 10.2207/qjjws.41.26a

Thermal conductivity and reliability reinforcement for sintered microscale Ag particle with AlN nanoparticles additive
Jianhao Wang*, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa*
Materials Characterization, 203, 113150 (2023)
doi: 10.1016/j.matchar.2023.113150

Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles
Jianhao Wang*, Shogo Yodo, Hiroaki Tatsumi, Hiroshi Nishikawa*
Materials Letters, 349, 134845 (2023)
doi: 10.1016/j.matlet.2023.134845

The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
Zhi Jin*, Fupeng Huo, Duy Le Han, Xunda Liu, Hiroaki Tatsumi, Y.C. Chan, Hiroshi Nishikawa*
Thin Solid Films, 774, 139827 (2023)
doi: 10.1016/j.tsf.2023.139827

2022

Anisotropic Highly Conductive Joints utilizing Cu-Solder Microcomposite Structure for High-Temperature Electronics Packaging
Hiroaki Tatsumi*, Hiroshi Nishikawa
Materials & Design, 223, 111204 (2022)
doi: 10.1016/j.matdes.2022.111204

Highly Efficient Soldering of Sn-Ag-Cu Solder Joints using Blue Laser
Hiroaki Tatsumi*, Seiji Kaneshita, Yuki Kida, Yuji Sato, Masahiro Tsukamoto, Hiroshi Nishikawa*
Journal of Manufacturing Processes, 82, pp.700–707 (2022)
doi: 10.1016/j.jmapro.2022.08.025

Solid-State Bonding Behavior between Surface-Nanostructured Cu and Au: A Molecular Dynamics Simulation
Hiroaki Tatsumi*, C. R. Kao, Hiroshi Nishikawa
Scientific Reports, 12, pp.12755 (2022)
doi: 10.1038/s41598-022-17119-w

2021

Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface-oxidized submicron Cu particles
Daiki Yamagiwa, Tomoki Matsuda*, Hideki Furusawa, Kenji Sato, Hiroaki Tatsumi, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Journal of Materials Science: Materials in Electronics, 32, pp.19031–19041 (2021)
doi: 10.1007/s10854-021-06418-z

2019

Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach
Hiroaki Tatsumi*, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Applied Sciences, 9, pp.3476–3490 (2019)
doi: 10.3390/app9173476

Evaluation of Stiffness-Reduced Joints by Transient Liquid-Phase Sintering of Copper-Solder-Resin Composite for SiC Die-Attach Applications
Hiroaki Tatsumi*, Adrian Lis, Hiroshi Yamaguchi, Yoshihiro Kashiba, Akio Hirose
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9, pp.2111-2121 (2019)
doi: 10.1109/TCPMT.2019.2916053

Reliability and Temperature Resistance of Solder–Metallic Mesh Composite Joints
Adrian Lis*, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Journal of Electronic Materials, 48, pp.3699–3712 (2019)
doi: 10.1007/s11664-019-07130-9

Evolution of Transient Liquid-Phase Sintered Cu-Sn Skeleton Microstructure During Thermal Aging
Hiroaki Tatsumi*, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Applied Sciences, 9, pp.157–168 (2019)
doi: 10.3390/app9010157

2018

Bonding through novel solder-metallic mesh composite design
Adrian Lis*, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Materials & Design, 160, pp.475-485 (2018)
doi: 10.1016/j.matdes.2018.09.017

2016

Impact of Metallurgical and Mechanical Properties of Sintered Silver Nanoparticles on Die-attach Reliability of High-temperature Power Modules
Hiroaki Tatsumi*, Sho Kumada, Atsushi Fukuda, Hiroshi Yamaguchi, Yoshihiro Kashiba
Journal of Microelectronics and Electronic Packaging, 13, pp.121-127 (2016)
doi: 10.4071/imaps.506

[Review paper] Packaging Technologies for High-Temperature Power Semiconductor Modules
Yasunari Hino, Nobuo Yokomura, Hiroaki Tatsumi
Mitsubishi Electric ADVANCE, 149, pp.18-20 (2016)
Link

2014

[解説記事] 高耐熱パワー半導体モジュールパッケージング要素技術
日野 泰成，長谷川 滋，山田 浩司，巽 裕章，横村 伸緒，畑中 康道
三菱電機技報, 88, pp.313-316 (2014)
Link

2012

Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation
Tomo Ogura*, Masumi Nishimura, Hiroaki Tatsumi, Wataru Takahara, Akio Hirose
Materials Transactions, 53, pp.2085-2090 (2012)
doi: 10.2320/matertrans.MB201201

Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag₂O for Packaging of High-temperature Electronics
Akio Hirose*, Naoya Takeda, Hiroaki Tatsumi, Yusuke Akada, Tomo Ogura, Eiichi. Ide, Toshiaki Morita
Materials Science Forum, 706-709, pp.2962-2967 (2012)
doi: 10.4028/www.scientific.net/MSF.706-709.2962

2011

Evaluation of Interfacial Bonding Utilizing Ag₂O-Derived Silver Nanoparticles using TEM Observation and Molecular Dynamics Simulation
Tomo Ogura*, Masumi Nishimura, Hiroaki Tatsumi, Naoya Takeda, Wataru Takahara, Akio Hirose
The Open Surface Science Journal, 3, pp.55-59 (2011)
doi: 10.2174/1876531901103010055

2009

A Novel Metal-to-Metal Bonding Process through In-situ Formation of Ag Nanoparticles Using Ag₂O Microparticles
Akio Hirose*, Hiroaki Tatsumi, Naoya Takeda, Yusuke Akada, Tomo Ogura, Eiichi Ide, Toshiaki Morita
Journal of Physics: Conference Series, 165, pp.012074_1-6 (2009)
doi: 10.1088/1742-6596/165/1/012074

2008

Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior
Yusuke Akada*, Hiroaki Tatsumi, Takuto Yamaguchi, Akio Hirose, Toshiaki Morita, Eiichi Ide
Materials Transactions, 49, pp.1537-1545 (2008)
doi: 10.2320/matertrans.MF200805

2007

Sintering Mechanism of Composite Ag Nanoparticles and its Application to Bonding Process
Hiroaki Tatsumi*, Yusuke Akada, Takuto Yamaguchi, Akio Hirose
Advanced Materials Research, 26-28, pp.499-502 (2007)
doi: 10.4028/www.scientific.net/AMR.26-28.499

Books

標準マイクロソルダリング技術　第4版
一般社団法人日本溶接協会マイクロソルダリング教育委員会 (共著)
日刊工業新聞社 (2024/3/30)
ISBN: 978-4526083280
https://amzn.asia/d/hxDMGYc

International Conference Papers

2024

Creep Behavior of Low-temperature Sn-In Solder using Nanoindentation Test
Shunya Nitta, Hiroaki Tatsumi, and Hiroshi Nishikawa
2024 IEEE International 3D Systems Integration Conference (3DIC 2024), pp.XX-XX (2024)
doi: XXX

Joint Strength of Transient Liquid Phase Bonding Using Cu–SAC Molded Sheet
Ichizo Sakamoto, Doojin Jeong, Hiroaki Tatsumi, and Hiroshi Nishikawa
2024 International Conference on Electronics Packaging (ICEP2024), pp.41-42 (2024)
doi: 10.23919/ICEP61562.2024.10535614

Low Thermal Resistance Joint using Lotus-type Cu/Solder Composite
Hiroaki Tatsumi, Hiroshi Isono, Kana Hirase, Takuya Ide, and Hiroshi Nishikawa
2024 International Conference on Electronics Packaging (ICEP2024), pp.51-52 (2024)
doi: 10.23919/ICEP61562.2024.10535580

Ag Sintered Joints on ENIG Cu Substrates by an Ag-based Complex
Chuncheng, Wang, Hiroaki Tatsumi, and Hiroshi Nishikawa
2024 International Conference on Electronics Packaging (ICEP2024), pp.95-96 (2024)
doi: 10.23919/ICEP61562.2024.10535647

2023

Molecular Dynamics Simulation of Cu-Cu Solid-State Bonding under Various Bonding Parameters
Hiroaki Tatsumi, C.R. Kao, and Hiroshi Nishikawa
2023 International Conference on Electronics Packaging (ICEP2023), pp.149-150 (2023)
doi: 10.23919/ICEP58572.2023.10129651

Failure Analysis of Joints Bonded by Ag-In Transient Liquid Phase Process during Shear Test
Xunda Liu, Hiroaki Tatsumi, Zhi Jin, and Hiroshi Nishikawa
2023 International Conference on Electronics Packaging (ICEP2023), pp.25-26 (2023)
doi: 10.23919/ICEP58572.2023.10129705

The Influence of Bi Content on Joint Properties using Sn-Bi-Zn-In Alloy
Hiroki Nakawaki, Hiroaki Tatsumi, Chih-han Yang, Shih-kang Lin, and Hiroshi Nishikawa
2023 International Conference on Electronics Packaging (ICEP2023), pp.209-210 (2023)
doi: 10.23919/ICEP58572.2023.10129655

Interfacial Intermetallic Compounds of Bi2Te3/Cu Joint using SAC305 Solder and Nano-Ag Paste
Seongwoo Pak, Hiroaki Tatsumi, Jianhao Wang, and Hiroshi Nishikawa
2023 International Conference on Electronics Packaging (ICEP2023), pp.199-200 (2023)
doi: 10.23919/ICEP58572.2023.10129738

Microstructure and Property of Ag Sintered Joint Doping with AlN Nanoparticles
Jianhao Wang, Shogo Yodo, Hiroaki Tatsumi, and Hiroshi Nishikawa
2023 International Conference on Electronics Packaging (ICEP2023), pp.145-146 (2023)
doi: 10.23919/ICEP58572.2023.10129686

Significant Consumption of Ni-P Layer in Ni-P/Sn-0.7Cu Solder Joints during Thermomigration
Satoshi Oya, Hiroaki Tatsumi, and Hiroshi Nishikawa
2023 International Conference on Electronics Packaging (ICEP2023), pp.81-82 (2023)
doi: 10.23919/ICEP58572.2023.10129736

2022

Mechanical properties of transient liquid phase bonded joints by using Ag-In sandwich structure
Xunda Liu*, Zhi Jin, Hiroaki Tatsumi, Hiroshi Nishikawa
24th Electronics Packaging Technology Conference (EPTC 2022), pp.71-75 (2022)
doi: 10.1109/EPTC56328.2022.10013239

Effect of isothermal aging on properties of In-48Sn and In-Sn-8Cu alloys
Duy Le Han*, Hiroaki Tatsumi, Fupeng Huo, Hiroshi Nishikawa
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), pp.2148-2152 (2022)
doi: 10.1109/ECTC51906.2022.00339

2018

Transient Liquid Phase Sintering Using Copper-Solder-Resin Composite for High- temperature Power Modules
Hiroaki Tatsumi*, Adrian Lis, Takeshi Monodane, Hiroshi Yamaguchi, Yoshihiro Kashiba, Akio Hirose
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), pp.564–567 (2018)
doi: 10.1109/ECTC.2018.00089

Novel solder-mesh interconnection design for power module applications
Adrian Lis*, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
International Conference and Exhibition on High Temperature Electronics (HiTEC), pp.57–62 (2018)
doi: 10.4071/2380-4491-2018-HiTEN-000057

2015

Impact of Metallurgical and Mechanical Properties of Sintered Silver Nanoparticles on Die-attach Reliability of High-temperature Power Modules
Hiroaki Tatsumi*, Sho Kumada, Atsushi Fukuda, Hiroshi Yamaguchi, Yoshihiro Kashiba
48th International Symposium on Microelectronics (IMAPS2015), pp.842-847 (2015)
doi: 10.4071/isom-2015-THP42

2009

A Novel Metal-to-metal Bonding Process Utilizing Low-temperature Sinterability of Ag₂O-derived Ag Nanoparticles
Naoya Takeda*, Hiroaki Tatsumi, Yusuke Akada, Tomo Ogura, Eiichi Ide, Toshiaki Morita, Akio Hirose
International Conference on Electronics Packaging 2009 (ICEP), pp.760-765 (2009)

2008

Investigation of Bonding Mechanism of Ag Nanoparticles to Bulk Metals
Yusuke Akada*, Hiroaki Tatsumi, Takuto Yamaguchi, Akio Hirose, Toshiaki Morita, Eiichi Ide
The Second International Symposium on Smart Processing Technology, pp.187-190 (2008)

Domestic Conference Papers

2024

• 平瀬 加奈，巽 裕章，西川 宏，“ロータス型ポーラス銅／はんだ複合接合部の熱伝導率評価”，第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集，pp.123-126 (2024)
• 林 雄二郎，Kim Jaemyung，矢橋 牧名，巽 裕章，“冷熱サイクル試験前後のはんだ接合の非破壊大面積方位マッピング”，第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集，pp.311-314 (2024)
• 川上 夏輝，巽 裕章，西川 宏，“Ni-P/AuめっきによるSn-Bi系合金バンプ継手特性評価”，第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集，pp.317-320 (2024)
• 巽 裕章，C. R. Kao，西川 宏，“分子動力学法によるCu-Cu接合界面のボイド消失挙動の評価”，第34回マイクロエレクトロニクスシンポジウム(MES2024)論文集，pp.411-412 (2024)
• 内田弘翔，巽 裕章，西川 宏，“ダイアタッチに向けたAg-Cu合金の脱合金化によるAgナノポーラスシートの作製”，第38回エレクトロニクス実装学会春季講演大会論文集，pp.165-166 (2024)
• 林雄二郎，Kim Jaemyung，矢橋 牧名，巽 裕章，“放射光X線回折によるパワーモジュール向けはんだ接合の大面積非破壊方位マッピング”，第38回エレクトロニクス実装学会春季講演大会論文集，pp.266-269 (2024)
• 中脇 啓貴，巽 裕章，Chih-han Yang，Shih-kang Lin，西川 宏，“Sn-Bi-Zn-In合金の微細組織が変形挙動に及ぼす影響”，第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集，pp.29-33 (2024)
• 貴田 優希，巽 裕章，竹中 啓輔，佐藤 雄二，塚本 雅裕，西川 宏，“青色半導体レーザを用いた純銅リボンはんだ付中の温度分布と微細組織の評価”，第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集，pp.49-53 (2024)
• 巽 裕章，磯野 浩，平瀬 加奈，井手 拓哉，西川 宏，“ロータス型ポーラス銅・はんだ複合構造を活用した高放熱モジュールの試作評価”，第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)論文集，pp.112-113 (2024)

2023

• 新田 隼也，巽 裕章，西川 宏，“Sn-In/ZrO₂ナノ粒子複合合金におけるナノ粒子表面の分散性への影響”，第33回マイクロエレクトロニクスシンポジウム(MES2023)論文集，pp.355-358 (2023)
• 貴田 優希，巽 裕章，竹中 啓輔，佐藤 雄二，塚本 雅裕，西川 宏，“青色半導体レーザを用いた純銅リボンはんだ付プロセスの短時間化”，第33回マイクロエレクトロニクスシンポジウム(MES2023)論文集，pp.291-294 (2023)
• 黒田 裕志，巽 裕章，西川 宏，“銀ナノ粒子ペースト焼結体のエレクトロマイグレーション現象における試験温度の影響”，第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2023)論文集，pp.90-93 (2023)
• 中脇 啓貴，巽 裕章，Chih-han Yang，Shih-kang Lin，西川 宏，“Sn-Bi-Zn-In合金の機械的特性に及ぼすBi添加量の影響”，第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2023)論文集，pp.132-133 (2023)
• 貴田 優希，巽 裕章，佐藤 雄二，塚本 雅裕，西川 宏，“青色半導体レーザ照射条件が純銅リボンのはんだ付継手特性に与える影響”，第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2023)論文集，pp.134-135 (2023)
• 淀 将悟，巽 裕章，西川 宏，“銀シートを用いた固相拡散接合の接合強度にシート内残留応力が及ぼす影響”，第29回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2023)論文集，pp.73-74 (2023)

2022

• 新田 隼也，巽 裕章，西川 宏，“表面改質したZrO₂ナノ粒子を添加したSn-In合金の作製と評価”，第32回マイクロエレクトロニクスシンポジウム(MES2022)論文集，pp.199-202 (2022)
• 綿谷 一駿，朴 炳浩，巽 裕章，西川 宏，“ダイアタッチ用表面微細構造Cuシートの提案”，第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2022)論文集，pp.108-111 (2022)
• 金下 征司，佐藤 雄二，巽 裕章，塚本 雅裕，西川　宏，“レーザはんだ付におけるはんだ溶融挙動の観察と継手の特性評価”，第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2022)論文集，pp.84-87 (2022)
• 碓井 脩斗，松田 朋己，藤野 純司，巽 裕章，小椋 智，加柴 良裕，廣瀬 明夫，“酸化銀マイクロ粒子を用いた銀-アルミニウム接合の低温化”，第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2022)論文集，pp.42-43 (2022)
• 黒田 裕志，金 智，巽 裕章，西川 宏，“銀ナノペースト焼結体のエレクトロマイグレーション現象評価”，第28回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2022)論文集，pp.313-314 (2022)

2020

• 山際 大貴，松田 朋己，巽 裕章，佐野 智一，加柴 良裕，古澤 秀樹，佐藤 賢次，廣瀬 明夫，“サブミクロン銅粒子を用いた無加圧接合における焼結プロセスの検討”，第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2020)論文集，pp.323-328 (2020)．

2018

• 巽 裕章，Adrian Lis，物種 武士，山口 博，加柴 良裕，廣瀬 明夫，“銅-はんだ-樹脂複合材を用いた液相拡散焼結法によるパワーモジュール向けダイアタッチ技術”，第28回マイクロエレクトロニクスシンポジウム(MES2018)論文集，pp.237-240 (2018)．

2016

• 藤野 純司，坂元 創一，柳本 辰則，巽 裕章，増森 俊二，“パワー半導体の高温動作を可能にするアセンブリ技術”，第26回マイクロエレクトロニクスシンポジウム(MES2016)論文集，pp.155-158 (2016)．

2015

• 巽 裕章，熊田 翔，福田 敦，山口 博，加柴 良裕，“銀ナノ粒子焼結接合部の信頼性に及ぼす機械的特性の影響”，第21回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2015)論文集，pp.75-80 (2015)．

2010

• 西村 眞澄，小椋 智，巽 裕章，武田 直也，小中 洋輔，高原 渉，廣瀬 明夫，”分子動力学シミュレーションを用いた銀ナノ粒子と基材金属との界面接合過程の検討”，第16回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2010)論文集，pp.129-134 (2010)．

2009

• 武田 直也，巽 裕章，赤田 裕亮，小椋 智，井出 英一，守田 俊章，廣瀬 明夫，“酸化銀マイクロ粒子を用いた銀ナノ粒子その場生成による新接合法”，第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2009)論文集，pp.195-200 (2009)．

2008

• 赤田 祐亮，巽 裕章，山口 拓人，廣瀬 明夫，守田 俊章，井出 英一，“銀ナノ粒子接合における界面接合機構の検討”，第14回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2008)論文集，vol. 14，pp.179-184 (2008)．
• 巽 裕章，赤田 祐亮，山口 拓人，廣瀬 明夫，“複合型銀ナノ粒子を用いた高温対応接合プロセス－接合性に及ぼす炭酸銀の影響”，第14回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2008)論文集，vol. 14. pp.173-178 (2008)．